5 Kriteria Utama dalam Memilih Produsen Silikon Karbida di Pasar B2B Global
| Parameter | Rentang Standar | Aplikasi Utama | Kritisitas | Metode Pengujian |
| Kemurnian (SiC %) | 85-99,81 TP3T (Kelas metalurgi hingga semikonduktor) | Bahan tahan api (85-90%), Bahan abrasif (95-97%), Elektronik (≥99%) | Tinggi | Analisis XRF |
| Ukuran Butiran | FEPA F12-F220 (kasar), P240-P2500 (halus) | Pengamplasan (P800–P2500), Roda pemotong (F30–F80) | Tinggi | Difraksi Laser |
| Kepadatan Massal | 1–1,6 g/cm³ (Bervariasi tergantung bentuk partikel) | Bahan cor tahan api (kepadatan tinggi), Bahan abrasif (porositas terkendali) | Sedang | ASTM B527 |
| Konduktivitas Termal | 120–200 W/m·K (25 °C) | Perlengkapan tungku, Penukar panas | Tinggi untuk bahan tahan api | ASTM E1461 |
| MOQ | 1–20 MT (Bervariasi tergantung produsen) | Pengadaan massal global | Komersial | – |
1. Technical Specifications & Material Standards
Particle Size Distribution & Morphology
FEPA Standards: F-grit (bonded abrasives), P-grit (precision polishing) [KB-1]
JIS R6001: Japanese standard for abrasive grains (e.g., #240 = 58.5±1.5 μm)
ASTM E11: US standard sieve sizes for coarse grades (8-220 mesh)
Particle Shape Analysis
Blocky grains (better for refractories)
Sharp/angular grains (superior for abrasives)
Nano-tubular structures (specialty applications) [KB-3]
Chemical Composition & Impurity Control
| Element | Metallurgical Grade | Refractory Grade | Electronic Grade | Analysis Method |
| SiC | ≥85% | ≥90% | ≥99.5% | XRF |
| Gratis C | ≤5% | ≤3% | ≤0.2% | LECO Analysis |
| Fe₂O₃ | ≤1.5% | ≤0.8% | ≤50 ppm | ICP-MS |
| Al | ≤0.5% | ≤0.3% | ≤10 ppm | GDMS |
2. Material Grades: Black vs Green Silicon Carbide
Comparative Properties Table
| Property | Black SiC (98.5% SiC) | Green SiC (≥99% SiC) | Measurement Standard |
| Kekerasan | 9.2-9.3 Mohs | 9.4-9.5 Mohs | ASTM C1327 |
| Fracture Toughness | 3.5-4.0 MPa·m½ | 2.8-3.2 MPa·m½ | ASTM E399 |
| Konduktivitas Termal | 120 W/m·K | 140 W/m·K | ASTM E1461 |
| Typical Cost | $800-$1,200/MT | $1,500-$2,500/MT | – |
Application Guidelines
Black SiC: Ideal for bonded abrasives (F24-F120), refractory bricks, and metallurgical additives
Green SiC: Essential for precision lapping (P800-P2500), semiconductor wafer processing, and optical polishing
3. Global Manufacturing & Supply Chain Considerations
North America: High-purity electronic grades
China: Cost-effective metallurgical grades
Japan: Precision abrasive grades (e.g., [KB-2])
4. Quality Assurance & Supplier Audit Checklist
Material Certifications
ISO 9001:2015 Quality Management
RoHS/REACH compliance documentation
Material Safety Data Sheets (MSDS)
Testing Capabilities
XRF for bulk composition
Laser particle size analyzer
SEM for grain morphology
Logistics Capabilities
Bulk container loading (20FT/40FT)
Moisture-proof packaging options
Hazardous material handling certification
Procurement Tip: Always request a batch-specific COA with
Lot number and production date
Actual test results (not typical values)
Measurement uncertainty ranges
5. Industrial Applications & Technical Requirements
| Industry | Key Requirements | Recommended Grade |
| Bahan abrasif | FEPA F/P standards, Hardness ≥9.2 Mohs | Black SiC (F24-F220) |
| Bahan tahan api | High thermal shock resistance | 95% SiC, 1.4-1.6 g/cm³ density |
| Semiconductors | ≤50 ppm metallic impurities | Green SiC ≥99.8% |
| Metallurgy | 85-90% SiC, ≤1.5% Fe₂O₃ | Crushed metallurgical grade |
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